openQCM NEXT
We have kept in mind thermal performances by designing each mechanical component of openQCM NEXT from scratch
OpenQCM NEXT design is the synthesis of all feedback received from the scientific
community. We have come up with a characteristic bridge design, realised with the aim of
maximising the thermal dissipation and electrical interferences of the electronics. The sensor
module has been replaced with a custom heat sink, in which it is embedded a PTFE “slot”,
housing the fluidic module. The fluidic module is the real holder of the quartz sensors, made to
be a multi-purpose accessory
SENSOR MODULE
More than a simple holder
The fluidic module is the real core of openQCM NEXT. Composed of two metal parts: the lower part, made of electropolished aluminium will be in direct contact with the Peltier element, and the upper part, composed of Nickel electroplated stainless steel (or PTFE where the samples are particularly sensitive to interactions with metals). All other materials are specifically selected in order to have the widest range of chemical compatibility with your samples. The fluidic circuit is directly engraved inside the top cover of the module, in order to enhance thermalisation of the incoming fluid. Furthermore we inserted a silica glass window for visual or spectroscopic inspection. If you need for specific spectral bandwidth, silica window, can be easily removed, in order to be replaced with your own optical window. Furthermore the fluidic module is designed as a plug-ad-play accessory that can be easily unplugged for treatments “out of the device” (eg: ultrasonic bath, thermal baking etc.)
inlet and outlet
Inlet and outlet lines, enter in the measurement chamber with a
specific tilting angle, in order to reduce flow perturbation
effects on the baseline (eg.: peristaltic waves), mainly during the
pumping phase.
See below!
Just below the bottom quartz surface, a 10K thermistor monitors the internal temperature of the fluidic module. Electrical contact pads on its microPCB are produced by immersion gold technique.
This process, drastically reduce the oxidation effects and consequently a degradation of S/N
with the time.
a SIMPLE GESTURE FOR PIPETTING
The heatsink The system is designed to be tiltable and facilitate its use for pipetting.
